SURFACE MOUNT ZENER DIODES

FEATURES

Planar Die construction
500mW Power Dissipation
Ideally Suited for Automated Assembly Processes
Lead free in comply with EU RoHS 2011/65/EU directives

MECHANICAL DATA

Case: Molded Glass MICRO-MELF
Terminals: Solderable per MIL-STD-750, Method 2026 Polarity: See Diagram Below
Mounting Position: Any