FEATURES

• For surface mounted applications in order to optimize board space • Easy pick and place
• Plastic package has Underwriters Laboratory Flammability

Classification 94V-O
• Low Forward Drop
• High temperature soldering : 260°C /10 seconds at terminals • Glass Passivated Junction
• Lead free in compliance with EU RoHS 2011/65/EU directive

• Green molding compound as per IEC61249 Std. . (Halogen Free)

MECHANICAL DATA

• Case: SMA(W) molded plastic
• Terminals: Solder plated, solderable per MIL-STD-750,Method 2026 • Polarity: Indicated by cathode band
• Standard packaging: 12 mm tape (EIA-481)
• Weight: 0.002 ounces, 0.068 grams